Detaping / Buffing
Semi Auto Machine
Fully Auto Machine
- Stack to Stack
- Stack to Slot
- Slot to Slot
- Tray to Tray
- With Detaping Module
- Detape Module
- Capable to handle all kind of tapes – Nitto/Hitachi/etc
- Heated Leadframe Clamping Platform with suction chucking
- Special Gripper to grip the tape even in small cutouts.
- Servo based dual axis robot to control the peel force, speed and pattern.
- Tape Debris Bin for discarding the removed tapes.
- Equipped with Laser Sensor for detecting and tape breakage.
- Detape module can be complemented with Laser or Buffing deflashing modules to reduce the processes
- Various on/offload options such as combinations of stack or slot magazines.
- PLC Based machine handler with vivid colored HMI
- High Speed Pick and Place Arms to correct the warpage of the packages.