Strip Laser Marking
Fully Auto Machine
- Stack to Stack
- Stack to Slot
- Slot to Slot
- With Buffing or Detaping Module
- Smallest Foot Print – 50% smaller than some popular brands (ASM was 3000×2000, and ours is 1500×1200.
- MAP package Handling (QFN, MAP BGA etc.
1. Warpage Handling/Correcting Mechanism.
2. Vacuum Chucking of Leadframe for precise and Robust location.
3. Unique Flipping Mechanism to enable both side markingAll kind of leadframes 30×120 to 100×300 size
- All kind of leadframes 30×120 to 100×300 size
- Integrated Vision with the Laser Head to enable following.
1. Accurate marking location wrt to the package that Nagates Offset/Mismatch
2. Post Marking Inspection
3. On the fly mark location adjustment
- Optional Laser Heads
1. UV Laser for very fine line width of 0.02mm for small packages.
2. Fiber Laser for general purpose line width of 0.04mm.
- Smart machine that is able to communicate up/down streams for lot/error reporting.
- PLC/Servo Driven Handler for robust, fast and precise operation.
- User Friendly GUI for Laser and Handler.
- Equipped with Full Safety Features.
- Low Power Consumption.