USP

• Smallest Foot Print – 50% smaller than some popular brands (ASM was 3000×2000, and ours is 1500×1200.
• MAP package Handling (QFN, MAP BGA etc.
  1. Warpage Handling/Correcting Mechanism.
  2. Vacuum Chucking of Leadframe for precise and Robust location.
  3. Unique Flipping Mechanism to enable both side markingAll kind of leadframes 30×120 to 100×300 size
• All kind of leadframes 30×120 to 100×300 size
• Integrated Vision with the Laser Head to enable following.
  1. Accurate marking location wrt to the package that Nagates Offset/Mismatch
  2. Post Marking Inspection
  3. On the fly mark location adjustment
• Optional Laser Heads
  1. UV Laser for very fine line width of 0.02mm for small packages.
  2. Fiber Laser for general purpose line width of 0.04mm.
• Smart machine that is able to communicate up/down streams for lot/error reporting.
• PLC/Servo Driven Handler for robust, fast and precise operation.
• User Friendly GUI for Laser and Handler.
• Equipped with Full Safety Features.
• Low Power Consumption.